Banana Screen Side Panel Integrated Forming Laser Plasma Flame Cutting Process Is Introduced In Detail
Banana screen is a banana shaped screening equipment specially used to screen coal, aggregate, ore, chemical and other materials. It has the advantages of large processing capacity, high screening efficiency and strong impact resistance.
Banana screen side panel is the core supporting structure of the screen box, which needs to withstand high frequency vibration and material impact. The cutting process of the side plate directly affects the strength, sealing and service life of the screen, so it is necessary to take into account precision control and material property protection. Our company introduces advanced laser cutting machine and plasma flame cutting equipment, and adopts the cutting method of integral molding for banana screen side panels to avoid quality problems caused by hardness reduction caused by splicing and welding.
Material selection and pretreatment
Plate specifications: Usually selected q345b low-alloy high-strength steel (thickness 10-25mm), or wear-resistant steel nm400 (extreme conditions), to meet the gb/t 1591 standard.
Pretreatment:
Plate leveling: Eliminate rolling residual stress, flatness error ≤2mm/m².
Sand blasting: Achieve sa2.5 level cleanliness (gb/ t8923), enhance subsequent coating adhesion.
Groove processing: According to welding requirements, v-type or k-type groove is used, the angle is 30°-45°, and the blunt edge is 1-2mm
Plasma cutting: Current 180-260a (adjusted according to plate thickness), cutting speed 0.8-1.5m/min, gas mixing ratio (ar+h₂ or n₂) to ensure smooth incision.
The “Symmetrical cutting method” Is used to cut alternately from the center of the plate to both sides to offset the thermal stress.
Preset anti-deformation tooling to compensate for shrinkage after cutting.
Use a laser tracker (e.g. Leica at960) to detect the profile of the side plate. Compared with the cad model, the allowable tolerance is: Length/width: ±1.5mm (gb/t 1804-m class) hole location: ±0.5mm (screen plate mounting hole group) roughness: Ra≤25μm (plasma/laser) or ra≤50μm (flame) to avoid welding crack sources. The deviation of the verticality between the cutting surface and the plate surface is less than 5% of the plate thickness to prevent assembly dislocation. Heat affected zone (haz) control: Water cooled cutting table or compressed air cooling, limiting haz width ≤1.5mm (q345b) to avoid grain coarsening. The hardness of the cutting edge should be ≤ 20% of the base material (hv10 detection), and the exceeded area should be annealed.
Banana screen side panel cutting needs to take precision control and material protection as the core, and ensure the reliability of the screen box structure through equipment selection, parameter optimization and anti-deformation design. In the future, it will develop in the direction of intelligence and high precision, further reduce manufacturing costs and extend the service cycle of the screen machine.
